fineplacer
@fineplacer
Flip chip bonder showing Chip on Glass and Adhesive ACP
10 years ago
Automatic Laser Bar Bonder with FINEPLACER pico ama
10 years ago
Thermosonic Bonding - Flip Chip Bonder ...powered by FINETECH
10 years ago
Laser bar bondng (automatic) on FINEPLACER® femto
10 years ago
Laser Bar Bonding - FINEPLACER® femto - Finetech
10 years ago
C2W and MCM Assembly
10 years ago
Solder paste dispensing (motorized)
10 years ago
Thermosonic Bonding using Gold on Gold Process on FINEPLACER® lambda
10 years ago
Laboratory, R&D and Prototyping Die Bonding on FINEPLACER® lambda
10 years ago
Laser Bar Bonding using Gold Tin Process on FINEPLACER® lambda
10 years ago
Contactless residual solder removal
10 years ago
0201 rework & repair small passives
10 years ago
Package on Package (PoP) rework & repair
10 years ago
01005 rework & repair
10 years ago
QFN soldering rework & repair
10 years ago
BGA Single ball rework
10 years ago
µBGA soldering rework & repair (2x3mm)
10 years ago
Contactless BGA residual solder removal
10 years ago
Residual Solder Removal in Air Atmosphere (_Chocolate Kiss_)
10 years ago
Residual Solder Removal in Nitrogen Atmospere
10 years ago
QFN Rework - Direct Component Printing
10 years ago
BGA Rework: removal using nitrogen
10 years ago
BGA Rework: removal in air atmoshere
10 years ago
BGA Reballing on stand-alone unit
10 years ago
How to reball BGA components
10 years ago
Complete BGA rework cycle including reballing (Rework Station)
10 years ago
Chip Scale Package (CSP) rework on mobile phone board
10 years ago