Laser Bar Bonding - FINEPLACER® femto - Finetech
The machine used in this video is here:
http://eu.finetech.de/micro-assembly/products/fineplacerr-femto.html
More information about Laser Bar Bonding:
http://eu.finetech.de/micro-assembly/applications/laser-bar-bonding.html
The FINEPLACER® femto is a fully automated, sub-micron bonding platform for advanced packaging and optoelectronic applications.
This award winning system offers modular application architecture and can be flexibly equipped for a wide range of applications and processes. It is an ideal system for a production environment as well as for product and process development, accommodating the complete production workflow of inspection, characterization, packaging, final test and qualification.
http://eu.finetech.de/micro-assembly/products/fineplacerr-femto.html
More information about Laser Bar Bonding:
http://eu.finetech.de/micro-assembly/applications/laser-bar-bonding.html
The FINEPLACER® femto is a fully automated, sub-micron bonding platform for advanced packaging and optoelectronic applications.
This award winning system offers modular application architecture and can be flexibly equipped for a wide range of applications and processes. It is an ideal system for a production environment as well as for product and process development, accommodating the complete production workflow of inspection, characterization, packaging, final test and qualification.
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