read more: eu.finetech.de/advanced-rework/processes/residual-solder-removal.html
Contactless residual solder removal in one sweep: After starting a reflow process, molten solder is easily removed from the board with powerful vacuum. The new generation of solder removal heads allow contactless residual solder removal without any disturbing pads or solder resist.
As the component has been removed in air atmosphere, due to oxidation of the solder, surface tension effects preclude the residual solder from collapsing and forming a meniscus in characteristic "chocolate" kiss shape.
Contactless residual solder removal in one sweep: After starting a reflow process, molten solder is easily removed from the board with powerful vacuum. The new generation of solder removal heads allow contactless residual solder removal without any disturbing pads or solder resist.
As the component has been removed in air atmosphere, due to oxidation of the solder, surface tension effects preclude the residual solder from collapsing and forming a meniscus in characteristic "chocolate" kiss shape.
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