iPhone 7 is expected to be released in the month of September next year 2016 by the time the iPhone 6s and iPhone 6s Plus complete one year in the market. It may also be mentioned that Apple has the tradition of releasing its flagship device in the third quarter of the year.
According to a report by Know Your Mobile, Apple has filed a new patent for better antenna and zero plastic, hinting that its upcoming flagship device may come with a complete metal body. The patent highlights how materials like metal oxides can be used instead of plastic as it allows radio frequencies to pass through.
It is reported that iPhone 7 may sport a flat LCD screen panel sans Apple's iconic Home button, waterproof and dustproof, and camera with six-element lenses, which is superior to the one seen in the recently released iPhone 6s and 6s Plus.
The upcoming flagship device is expected to be the slimmest iPhone. Analyst Ming-Chi Kuo of KGI Securities said in a note to investors that Apple is planning to make its upcoming iPhone, possibly the iPhone 7, between 6.0 and 6.5 mm thick, according to a report by DigiTimes.
The device is also expected to be powered by A10 chip, which is much stronger than the one seen in the iPhone 6s. Geek has reported that the Cupertino-based giant has placed orders for parts of iPhone 7 and mass production of its processor may start in March next. It went on to claim that Taiwan Semiconductor Manufacturing Company (TSMC) has secured exclusive supply contract of chips.
According to a report by Know Your Mobile, Apple has filed a new patent for better antenna and zero plastic, hinting that its upcoming flagship device may come with a complete metal body. The patent highlights how materials like metal oxides can be used instead of plastic as it allows radio frequencies to pass through.
It is reported that iPhone 7 may sport a flat LCD screen panel sans Apple's iconic Home button, waterproof and dustproof, and camera with six-element lenses, which is superior to the one seen in the recently released iPhone 6s and 6s Plus.
The upcoming flagship device is expected to be the slimmest iPhone. Analyst Ming-Chi Kuo of KGI Securities said in a note to investors that Apple is planning to make its upcoming iPhone, possibly the iPhone 7, between 6.0 and 6.5 mm thick, according to a report by DigiTimes.
The device is also expected to be powered by A10 chip, which is much stronger than the one seen in the iPhone 6s. Geek has reported that the Cupertino-based giant has placed orders for parts of iPhone 7 and mass production of its processor may start in March next. It went on to claim that Taiwan Semiconductor Manufacturing Company (TSMC) has secured exclusive supply contract of chips.
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